Mini project

      Last week, it was the greatest experience I ever have as finally I can produce my own mini project. Under the guidance of Mr.RedZuan, we do the circuit design and the board by our own from the beginning step to the end.

     Firstly, Mr Redzuan shows us about the video that gave us a briefing about the procedures to work on the circuit board.

    After tear off the plastic on the circuit board, we use the cellotape to fix the position of our board outline on the board to prepare for the expose of UV ray. The time was set for one and half minute to expose the board outline on the board. Safety precaution was taken to avoid the blockage of the cellotape on the board outline.

   Next, the board that had been fully exposed was ready to be developed. The chemical we used for developing is sodium and this chemical is essential to remove the green chemical surface (photorysis). By agitate the tray that contained the board and sodium liquid, we could see that the green surface was removed successfully.

  Then, the etching process is the step that I hate most. The acid powder that needed to be colleted is burning my hand. Also need to be careful as the acid powder is poisonous that will cause the cancer disease.
After collected the acid powder, hot water was used to dissolve the acid powder in the tray to undergo the etching process. This process removed the copper area that are not needed on the board.

  After that, 50% of our board is complete. The tools was provided for us to cut the board into seperate board for our group member.

  The drilling process will be the next step for us. This process make holes on the board for the through-hole components. The pacs that have the symbol of hole on the board were the places that need to be drilled. This technic was also been taught by Mr.Redzuan to avoid the misuse of the drilling tools as the needle that use to drill is easy to being broke if we use the wrong method to handle.

  Then, we need to assemble the components on the board before we soldered the components on the board. This two processes were the processes that took us for a long time. Mr.Redzuan showed us the correct way to solder the through-hole components and SMD on different boards. But due to the lack of time, we only manage to do it to the halfway on Monday and Mr.Redzuan allowed us to continue our work on the following day.